公开(公告)号：US09387613B2

公开(公告)日：2016-07-12

申请号：US14286282

申请日：2014-05-23

Applicant: Infineon Technologies AG

Inventor： Carlo Baterna Marbella ,  Ching Yun Tye ,  Ramasubramanian Natarajan

IPC: H01L23/495 ,  B29C45/27 ,  H01L23/31 ,  H01L21/56 ,  B29L31/34

CPC classification number: B29C45/2703 ,  B29L2031/3406 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor package formation arrangement includes a mold housing with an interior cavity having top, bottom and first and second end sides. A gate for transferring liquefied molding material extends to the first end side. A lead frame having a top surface, a rear surface opposite the top surface and a mold flow modifier forms a first cavity section between the top surface and the top side and a second cavity section between the rear surface and the bottom side. A topology of the lead frame causes liquefied molding material to fill the first and second cavity sections at different rates. The mold flow modifier extends away from the lead frame so as to compensate for the difference between the first and second rates.

Abstract translation: 半导体封装形成装置包括具有内部空腔的模具壳体，其具有顶部，底部以及第一和第二端侧。 用于转移液化模塑材料的浇口延伸到第一端侧。 具有顶表面，与顶表面相对的后表面的引线框架和模流改性剂在顶表面和顶侧之间形成第一空腔部分，并且在后表面和底侧之间形成第二空腔部分。 引线框架的拓扑结构使得液化的模制材料以不同的速率填充第一和第二腔部分。 模具流动调节器远离引线框架延伸，以补偿第一和第二速率之间的差异。

公开(公告)号：US20150336314A1

公开(公告)日：2015-11-26

申请号：US14286282

申请日：2014-05-23

Applicant: Infineon Technologies AG

Inventor： Carlo Baterna Marbella ,  Ching Yun Tye ,  Ramasubramanian Natarajan

IPC: B29C45/27 ,  H01L23/31 ,  H01L21/56 ,  H01L23/495

CPC classification number: B29C45/2703 ,  B29L2031/3406 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor package formation arrangement includes a mold housing with an interior cavity having top, bottom and first and second end sides. A gate for transferring liquefied molding material extends to the first end side. A lead frame having a top surface, a rear surface opposite the top surface and a mold flow modifier forms a first cavity section between the top surface and the top side and a second cavity section between the rear surface and the bottom side. A topology of the lead frame causes liquefied molding material to fill the first and second cavity sections at different rates. The mold flow modifier extends away from the lead frame so as to compensate for the difference between the first and second rates.

Abstract translation: 半导体封装形成装置包括具有内部空腔的模具壳体，其具有顶部，底部以及第一和第二端侧。 用于转移液化模塑材料的浇口延伸到第一端侧。 具有顶表面，与顶表面相对的后表面的引线框架和模流改性剂在顶表面和顶侧之间形成第一空腔部分，并且在后表面和底侧之间形成第二空腔部分。 引线框架的拓扑结构使得液化的模制材料以不同的速率填充第一和第二腔部分。 模具流动调节器远离引线框架延伸，以补偿第一和第二速率之间的差异。