公开(公告)号：US11362080B2

公开(公告)日：2022-06-14

申请号：US16697444

申请日：2019-11-27

Applicant: Infineon Technologies AG

Inventor： Christian Robert Mueller ,  Christoph Urban

IPC: H01L25/18 ,  H01L23/538 ,  H01L23/00 ,  H01L23/367 ,  H02M7/5387

Abstract: A semiconductor arrangement includes at least one switching device, electrically coupled between a first terminal and a second terminal, at least one diode, coupled in parallel to the at least one switching device between the first terminal and the second terminal, at least one bonding pad, and at least one electrically connecting element. Each of the at least one electrically connecting element is arranged to electrically couple one of the at least one switching device to one of the at least one diode. Each electrically connecting element includes a first end, a second end, and a middle section, and for at least one of the electrically connecting element, the first end is mechanically coupled to the respective switching device, the second end is mechanically coupled to the respective diode, and the middle section is mechanically coupled to at least one of the at least one bonding pad.