公开(公告)号：US20230117806A1

公开(公告)日：2023-04-20

申请号：US17952688

申请日：2022-09-26

Applicant: Infineon Technologies AG

Inventor： Thorsten MEYER ,  Thomas BEHRENS ,  Christian IRRGANG ,  Frank ZUDOCK

IPC: H01L21/56 ,  H01L23/00 ,  H01L25/16 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/29

Abstract: Semiconductor packages and methods for manufacturing are disclosed. In one example, a method for manufacturing a semiconductor package includes providing an electrically conductive chip carrier including a mounting surface and a protrusion extending out of the mounting surface. At least one semiconductor chip is arranged on the mounting surface. The method further includes encapsulating the protrusion and the at least one semiconductor chip in an encapsulation material, wherein surfaces of the protrusion and the at least one semiconductor chip facing away from the mounting surface remain uncovered by the encapsulation material. An electrical redistribution layer is formed over the surfaces of the protrusion and the at least one semiconductor chip facing away from the mounting surface. The electrical redistribution layer provides an electrical connection between the protrusion and the at least one semiconductor chip.