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公开(公告)号：US20170317016A1
公开(公告)日：2017-11-02
申请号：US15497267
申请日：2017-04-26
Applicant: Infineon Technologies AG
Inventor： Alexander HEINRICH , Bernd GOLLER , Thorsten MEYER , Gerald OFNER
IPC: H01L23/498 , H01L21/56 , H01L23/31 , H01L23/00
Abstract: A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.
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