公开(公告)号：US20240122081A1

公开(公告)日：2024-04-11

申请号：US17961795

申请日：2022-10-07

Applicant: Infineon Technologies AG

Inventor： Valentyn Solomko ,  Semen Syroiezhin ,  Dominik Heiss ,  Christian Butschkow ,  Jochen Braumueller

IPC: H01L45/00

CPC classification number: H01L45/06 ,  H01L45/1286 ,  H01L45/1226

Abstract: A phase change switching device includes a substrate comprising a main surface, an RF input pad and a plurality of RF output pads disposed over the main surface, and phase change switch connections between the RF input pad and each of the RF output pads, wherein the phase change switch connections each include a phase change material and a heating element thermally coupled to the phase change material, wherein each of the RF output pads are arranged outside of an outer perimeter of the RF input pad, and wherein plurality of RF output pads at least partially surrounds the outer perimeter of the RF input pad.