公开(公告)号：US20220122906A1

公开(公告)日：2022-04-21

申请号：US17485742

申请日：2021-09-27

Applicant: Infineon Technologies AG

Inventor： Sergey YUFEREV ,  Paul Armand Asentista CALO ,  Theng Chao LONG ,  Josef MAERZ ,  Chee Yang NG ,  Petteri PALM ,  Wae Chet YONG

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/00

Abstract: A package and method of manufacturing a package is disclosed. In one example, a package which comprises a first transistor chip having a first source pad and a second transistor chip having a second source pad and being stacked with the first transistor chip at an interface area. The first source pad and the second source pad are coupled at the interface area.