公开(公告)号：US12170226B2

公开(公告)日：2024-12-17

申请号：US18620327

申请日：2024-03-28

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Benjamin Bernard ,  Mario Stefenelli

IPC: H01L21/82 ,  H01L21/02 ,  H01L21/268 ,  H01L21/304 ,  H01L21/324 ,  H01L21/683 ,  H01L29/16

Abstract: A method for separating dies from a semiconductor substrate having dies adjoining a first surface of the substrate includes: attaching the substrate to a carrier via the first surface; generating first modifications by introducing laser irradiation into an interior of the substrate via a second surface of the substrate, the first modifications extending between the first surface and a vertical level in the interior that is being spaced from the second surface, the first modifications laterally surrounding the dies; generating second modifications by introducing laser irradiation into the interior via the second surface, the second modifications sub-dividing the substrate into a first part between the first surface and the second modifications, and a second part between the second surface and the second modifications; separating the parts along a first separation area defined by the second modifications; and separating the dies along a second separation area defined by the first modifications.

公开(公告)号：US20240339361A1

公开(公告)日：2024-10-10

申请号：US18620327

申请日：2024-03-28

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Benjamin Bernard ,  Mario Stefenelli

IPC: H01L21/82 ,  H01L21/02 ,  H01L21/268 ,  H01L21/304 ,  H01L21/324 ,  H01L21/683 ,  H01L29/16

CPC classification number: H01L21/8213 ,  H01L21/02118 ,  H01L21/268 ,  H01L21/304 ,  H01L21/324 ,  H01L21/6836 ,  H01L29/1608 ,  H01L2221/68309 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: A method for separating dies from a semiconductor substrate having dies adjoining a first surface of the substrate includes: attaching the substrate to a carrier via the first surface; generating first modifications by introducing laser irradiation into an interior of the substrate via a second surface of the substrate, the first modifications extending between the first surface and a vertical level in the interior that is being spaced from the second surface, the first modifications laterally surrounding the dies; generating second modifications by introducing laser irradiation into the interior via the second surface, the second modifications sub-dividing the substrate into a first part between the first surface and the second modifications, and a second part between the second surface and the second modifications; separating the parts along a first separation area defined by the second modifications; and separating the dies along a second separation area defined by the first modifications.