公开(公告)号：US20250016918A1

公开(公告)日：2025-01-09

申请号：US18751647

申请日：2024-06-24

Applicant: Infineon Technologies AG

Inventor： Martin Richard NIEßNER ,  Walter HARTNER ,  Gerhard HAUBNER

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/30

Abstract: A printed circuit board for mounting at least one semiconductor chip device includes a metal structure provided in a first area of the printed circuit board for soldering the semiconductor chip device onto the metal structure. The printed circuit board includes a main surface, a layer stack including a first layer extending parallel to the main surface and a second layer extending parallel to the main surface. The first layer includes a first material having a first coefficient of thermal expansion in a lateral direction and the second layer includes a second material having a second coefficient of thermal expansion in the lateral direction such that the printed circuit board is forced by the layer stack into a curved shape at least in the first area of the printed circuit board.