公开(公告)号：US20230116926A1

公开(公告)日：2023-04-20

申请号：US18069371

申请日：2022-12-21

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Jochen DANGELMAIER ,  Matthias EBERL ,  Simon GASSNER ,  Franz JOST ,  Stefan KOLB ,  Horst THEUSS

IPC: G01N29/02 ,  B81B3/00

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

公开(公告)号：US20220379669A1

公开(公告)日：2022-12-01

申请号：US17335478

申请日：2021-06-01

Applicant: Infineon Technologies AG

Inventor： Thomas ENGL ,  Matthias EBERL ,  Manfred EDER ,  Michael KANDLER ,  Maximilian WERNER

IPC: B60C23/04 ,  H04B7/06 ,  H04B7/08 ,  H04W76/14 ,  G01S3/48

Abstract: A method of communicating with a tire pressure monitoring system (TPMS) sensor module includes transmitting, by the TPMS sensor module, a TPMS signal that includes a sensor identifier of the TPMS sensor module; performing, by an interface device, an angle of arrival measurement on the TPMS signal to whether an angular direction thereof with respect to an antenna array of the interface device is within a predetermined angular window; and determining, by the interface device, whether or not to communicate with the TPMS sensor module including establishing communication with the TPMS sensor module on a condition that the angular direction is within the predetermined angular window and not establishing communication with the TPMS sensor module on a condition that the determined angular direction is not within the predetermined angular window.

公开(公告)号：US20240094850A1

公开(公告)日：2024-03-21

申请号：US18159817

申请日：2023-01-26

Applicant: Infineon Technologies AG

Inventor： Emanuel STOICESCU ,  Matthias EBERL ,  Costin BATRINU ,  Klaus ELIAN

IPC: G06F3/041 ,  G06F3/043 ,  G06F3/044

CPC classification number: G06F3/04186 ,  G06F3/043 ,  G06F3/044 ,  G06F2203/04105

Abstract: A touch sensor includes a touch structure including a touch interface and an inner interface arranged opposite to the touch interface; a capacitive ultrasonic transmitter arranged inside an enclosed interior volume and configured to transmit an ultrasonic transmit wave towards the touch structure; a capacitive ultrasonic receiver arranged inside the enclosed interior volume and configured to receive at least one ultrasonic reflected wave produced from the ultrasonic transmit wave via internal reflection; a coupling medium that fills an area between the inner interface and the capacitive ultrasonic receiver, wherein an external force applied to the touch interface is configured to impart an internal pressure onto the capacitive ultrasonic receiver through the coupling medium; and a sensor circuit configured to convert the at least one ultrasonic reflected wave into a measurement signal and detect the external force based on the measurement signal.

公开(公告)号：US20230315235A1

公开(公告)日：2023-10-05

申请号：US18188611

申请日：2023-03-23

Applicant: Infineon Technologies AG

Inventor： Klaus ELIAN ,  Matthias EBERL ,  Horst THEUSS ,  Rainer Markus SCHALLER ,  Fabian MERBELER

IPC: G06F3/043

CPC classification number: G06F3/043 ,  G06F2203/04103

Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

公开(公告)号：US20220196585A1

公开(公告)日：2022-06-23

申请号：US17457752

申请日：2021-12-06

Applicant: Infineon Technologies AG

Inventor： Julia Isabel PEREZ BARRAZA ,  Matthias EBERL ,  Francesco SOLAZZI

IPC: G01N27/12 ,  G01N33/00

Abstract: It is proposed a sensor for measuring a gas property, wherein the sensor comprises a semiconductor die, wherein the semiconductor die comprises a reference cavity and a measuring cavity, wherein a reference sensor element is arranged in the reference cavity, wherein a measuring sensor element is arranged in the measuring cavity, wherein the reference cavity is sealed from ambient gas, wherein the measuring cavity is fluidly connected to ambient gas. Further it is proposed a method for manufacturing such a sensor.

公开(公告)号：US20220028764A1

公开(公告)日：2022-01-27

申请号：US17305885

申请日：2021-07-16

Applicant: Infineon Technologies AG

Inventor： Eduardo SCHITTLER NEVES ,  Rainer Markus SCHALLER ,  Matthias EBERL ,  Franz Michael DARRER

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01Q1/22

Abstract: A semiconductor device comprises a semiconductor chip and an electrically conductive chip carrier, wherein the semiconductor chip is mounted on the chip carrier. The semiconductor device furthermore comprises an electrically conductive extension element mechanically connected to the chip carrier, wherein the extension element and the chip carrier are formed as an integral single piece. A part of the chip carrier which has the extension element is configured as an antenna.

公开(公告)号：US20240393272A1

公开(公告)日：2024-11-28

申请号：US18665352

申请日：2024-05-15

Applicant: Infineon Technologies AG

Inventor： Michael KANDLER ,  Matthias EBERL ,  Gerald HANSEKOWITSCH

IPC: G01N25/18 ,  G01N33/00

Abstract: A method for operating a thermal conductivity sensor includes the following steps: (i) applying a supply voltage to a measurement element of the thermal conductivity sensor, wherein the supply voltage results in a temperature increase of the measurement element to a characteristic temperature at which the measurement element is sensitive to a thermal conductivity of an analysis gas, (ii) performing a first measurement by the measurement element during the temperature increase before the measurement element has reached the characteristic temperature, thereby providing a first measurement value, (iii) performing a second measurement by the measurement element at a time when the measurement element has reached the characteristic temperature, thereby providing a second measurement value, and (iv) obtaining a compensated measurement value by compensating an offset of the second measurement value based on the first measurement value.

公开(公告)号：US20240192809A1

公开(公告)日：2024-06-13

申请号：US18469010

申请日：2023-09-18

Applicant: Infineon Technologies AG

Inventor： Emanuel STOICESCU ,  Matthias EBERL ,  Mohanraj SOUNDARA PANDIAN ,  Klaus ELIAN ,  Costin BATRINU

IPC: G06F3/043 ,  G06F3/041

CPC classification number: G06F3/043 ,  G06F3/0416

Abstract: An ultrasonic touch sensor includes a touch structure having a touch surface with a plurality of sensitive areas, a pixel array of capacitive ultrasonic transducers, and a sensor circuit. Each pixel includes a respective ultrasonic transmitter and a respective ultrasonic receiver and is configured to monitor for a touch at a respective first sensitive area and at a respective second sensitive area. Moreover, each pixel is configured to generate a measurement signal that is representative of a first respective ultrasonic reflected wave reflected by the touch interface at the respective first sensitive area or that is representative of a second respective ultrasonic reflected wave reflected by the touch interface at the respective second sensitive area. The sensor circuit is configured to determine whether the measurement signal of a respective pixel corresponds to the respective first sensitive area or to the respective second sensitive area associated with the respective pixel.

公开(公告)号：US20220074897A1

公开(公告)日：2022-03-10

申请号：US17446507

申请日：2021-08-31

Applicant: Infineon Technologies AG

Inventor： Matthias EBERL ,  Franz JOST ,  Stefan KOLB

IPC: G01N29/24 ,  G01N29/024

Abstract: A gas sensor having a heater, a receiver, and a space arranged between the heater and the receiver, is described, the heater being configured to generate a thermoacoustic sound wave propagating through the space by using a stimulation signal. The receiver is in this case configured to receive the thermoacoustic sound wave that has propagated through the space and to convert it into a reception signal that has a time-of-flight-dependent shift with respect to the stimulation signal and therefore information relating to the gas concentration in the space.

公开(公告)号：US20210181158A1

公开(公告)日：2021-06-17

申请号：US17247134

申请日：2020-12-01

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Matthias EBERL ,  Simon GASSNER ,  Franz JOST ,  Stefan KOLB

IPC: G01N29/24

Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.