公开(公告)号：US20230116926A1

公开(公告)日：2023-04-20

申请号：US18069371

申请日：2022-12-21

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Jochen DANGELMAIER ,  Matthias EBERL ,  Simon GASSNER ,  Franz JOST ,  Stefan KOLB ,  Horst THEUSS

IPC: G01N29/02 ,  B81B3/00

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

公开(公告)号：US20210181158A1

公开(公告)日：2021-06-17

申请号：US17247134

申请日：2020-12-01

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Matthias EBERL ,  Simon GASSNER ,  Franz JOST ,  Stefan KOLB

IPC: G01N29/24

Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

公开(公告)号：US20230296567A1

公开(公告)日：2023-09-21

申请号：US18322755

申请日：2023-05-24

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Matthias EBERL ,  Simon GASSNER ,  Franz JOST ,  Stefan KOLB

IPC: G01N29/24

CPC classification number: G01N29/2425 ,  G01N33/0004

Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

公开(公告)号：US20210181151A1

公开(公告)日：2021-06-17

申请号：US17116029

申请日：2020-12-09

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Jochen DANGELMAIER ,  Matthias EBERL ,  Simon GASSNER ,  Franz JOST ,  Stefan KOLB ,  Horst THEUSS

IPC: G01N29/02 ,  B81B3/00

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.