公开(公告)号：US11410950B2

公开(公告)日：2022-08-09

申请号：US17023538

申请日：2020-09-17

Applicant: Infineon Technologies AG

Inventor： Gert Pfahl ,  Daniel Bolowski ,  Marian Sebastian Broll ,  Michael Kreuz ,  Evelyn Napetschnig ,  Holger Schulze ,  Stefan Woehlert

IPC: H01L23/00 ,  C22C21/10 ,  C22C21/16 ,  C22C21/02

Abstract: A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.

公开(公告)号：US20210091025A1

公开(公告)日：2021-03-25

申请号：US17023538

申请日：2020-09-17

Applicant: Infineon Technologies AG

Inventor： Gert Pfahl ,  Daniel Bolowski ,  Marian Sebastian Broll ,  Michael Kreuz ,  Evelyn Napetschnig ,  Holger Schulze ,  Stefan Woehlert

IPC: H01L23/00 ,  C22C21/10 ,  C22C21/16 ,  C22C21/02

Abstract: A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.