公开(公告)号：US20180174935A1

公开(公告)日：2018-06-21

申请号：US15838417

申请日：2017-12-12

Applicant: Infineon Technologies AG

Inventor： Hock Heng CHONG ,  Sook Woon CHAN ,  Chau Fatt CHIANG ,  Khar Foong CHUNG ,  Chee Hong FANG ,  Muhammat Sanusi MUHAMMAD ,  Mei Chin NG ,  Yean Seng NG ,  Pei Luan POK ,  Choon Huey WANG

IPC: H01L23/28 ,  H01L23/00

Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.