公开(公告)号：US12272669B2

公开(公告)日：2025-04-08

申请号：US17582832

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Arthur Unrau ,  Szabolcs Barna ,  Tobias Buehner ,  Norbert Kanvasi

IPC: B23K1/00 ,  B23K3/08 ,  H01L23/00 ,  B23K101/40

Abstract: An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.

公开(公告)号：US20220238478A1

公开(公告)日：2022-07-28

申请号：US17582832

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Arthur Unrau ,  Szabolcs Barna ,  Tobias Buehner ,  Norbert Kanvasi

IPC: H01L23/00 ,  B23K1/00 ,  B23K3/08

Abstract: An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.