公开(公告)号：US09543199B2

公开(公告)日：2017-01-10

申请号：US14138241

申请日：2013-12-23

Applicant: Infineon Technologies AG

Inventor： Oliver Aubel ,  Wolfgang Hasse ,  Martina Hommel ,  Heinrich Koerner

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L21/76864 ,  H01L21/76843 ,  H01L21/76844 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76858 ,  H01L21/76865 ,  H01L21/76867 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76886 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.

Abstract translation: 特别地说明了通过长期热处理在通孔底部或通孔顶部区域去除阻挡材料的方法。 同时或替代地，互连通过长期热处理以简单且不复杂的方式涂覆有阻挡材料。

公开(公告)号：US20160049329A1

公开(公告)日：2016-02-18

申请号：US14138241

申请日：2013-12-23

Applicant: Infineon Technologies AG

Inventor： Oliver Aubel ,  Wolfgang Hasse ,  Martina Hommel ,  Heinrich Koerner

IPC: H01L21/768

CPC classification number: H01L21/76864 ,  H01L21/76843 ,  H01L21/76844 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76858 ,  H01L21/76865 ,  H01L21/76867 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76886 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.

Abstract translation: 特别地说明了通过长期热处理在通孔底部或通孔顶部区域去除阻挡材料的方法。 同时或替代地，互连通过长期热处理以简单且不复杂的方式涂覆有阻挡材料。