公开(公告)号：US09651979B2

公开(公告)日：2017-05-16

申请号：US14925394

申请日：2015-10-28

Applicant: Infineon Technologies AG

Inventor： Thomas Hunger ,  Carsten Ehlers

IPC: H01L21/00 ,  G05F3/02 ,  H01L21/48 ,  H01L21/54 ,  H01L23/498 ,  B23K1/00 ,  H01L23/053 ,  H01L23/15 ,  H01L25/065 ,  H01L23/00 ,  H01L23/373

CPC classification number: G05F3/02 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/54 ,  H01L23/053 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/60 ,  H01L23/62 ,  H01L24/27 ,  H01L25/065 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A circuit carrier includes a dielectric isolation carrier, an upper metallization layer applied to the dielectric isolation carrier, and a dielectric coating. The upper metallization layer has a metallization section which has an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion. The side surface laterally delimits the metallization section and extends continuously between the top side and the underside. The dielectric coating is on the side surface and the top side, and extends continuously from the side surface onto the top side.

公开(公告)号：US20160132069A1

公开(公告)日：2016-05-12

申请号：US14925394

申请日：2015-10-28

Applicant: Infineon Technologies AG

Inventor： Thomas Hunger ,  Carsten Ehlers

IPC: G05F3/02 ,  B23K1/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/54

CPC classification number: G05F3/02 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/54 ,  H01L23/053 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/60 ,  H01L23/62 ,  H01L24/27 ,  H01L25/065 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A circuit carrier includes a dielectric isolation carrier, an upper metallization layer applied to the dielectric isolation carrier, and a dielectric coating. The upper metallization layer has a metallization section which has an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion. The side surface laterally delimits the metallization section and extends continuously between the top side and the underside. The dielectric coating is on the side surface and the top side, and extends continuously from the side surface onto the top side.

Abstract translation: 电路载体包括介电隔离载体，施加到电介质隔离载体的上部金属化层和介电涂层。 上部金属化层具有金属化部分，该金属化部分具有面向隔离载体的下侧，背离隔离载体的顶面和环形封闭的侧表面。 侧面横向限定金属化部分，并且在顶侧和下侧之间连续延伸。 电介质涂层在侧面和顶侧，并且从侧面连续地延伸到顶侧。