公开(公告)号：US08937380B1

公开(公告)日：2015-01-20

申请号：US14015522

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Uwe Fritzsche Schindler

IPC: H01L23/02 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0054 ,  B81B2201/0264 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83951 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The die further includes a second side opposite the first side, a lateral edge extending between the first and second sides and a terminal at the first side. An electrical conductor connects the terminal to the lead. An encapsulant is disposed along the lateral edge of the die so that the terminal and the electrical conductor are spaced apart from the encapsulant. The encapsulant has an elastic modulus of less 10 MPa at room temperature. A molding compound covers and contacts the lead, the electrical conductor, the encapsulant, the terminal and part of the first side of the die so that the diaphragm is uncovered by the molding compound.

Abstract translation: 半导体封装包括与半导体管芯间隔开的引线。 管芯包括设置在管芯的第一侧处的隔膜，并且被配置为响应于横跨隔膜的压差而改变电参数。 模具还包括与第一侧相对的第二侧，在第一侧和第二侧之间延伸的横向边缘和在第一侧的端子。 电导体将端子连接到引线。 沿着模具的侧边缘设置密封剂，使得端子和电导体与密封剂间隔开。 密封剂在室温下的弹性模量小于10MPa。 模塑料覆盖并接触导线，电导体，密封剂，端子和模具的第一面的一部分，使得隔膜不被模塑料覆盖。