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公开(公告)号：US20250100088A1
公开(公告)日：2025-03-27
申请号：US18774056
申请日：2024-07-16
Applicant: Infineon Technologies AG
Inventor： Alexander HEINRICH , Verena MUHR , Konrad RÖSL , Maximilian SIMMANN , Catharina WILLE
Abstract: A solder material is provided. In one or more examples, the solder material may include metal solder particles, a carboxylic acid, and an alcohol selected from the group consisting of methanol, ethanol, propan-1-ol, propan-2-ol, 2-methyl-1-propanol, butan-1-ol, pentan-1-ol, 1,2-propanediol, 1,3-propanediol, and glycerol.
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