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公开(公告)号：US20200043876A1
公开(公告)日：2020-02-06
申请号：US16520597
申请日：2019-07-24
Applicant: Infineon Technologies AG
Inventor： Evelyn Napetschnig , Wei Cheat Lee , Wei Lee Lim , Frank Renner , Michael Rogalli
IPC: H01L23/00
Abstract: A package includes an electronic chip having a pad. The pad is at least partially covered with adhesion enhancing structures. The pad and the adhesion enhancing structures have at least aluminium in common.
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