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公开(公告)号:US20210381103A1
公开(公告)日:2021-12-09
申请号:US17339634
申请日:2021-06-04
IPC分类号: C23C16/04 , B01J20/28 , B01J20/20 , B01J20/32 , C23C16/18 , C23C16/455 , B01J20/282
摘要: The present description provides structures, atomic layer deposition methods for preparing the structures, and an apparatus preparing the structures. The described structures provide unexpected advantages as compared to currently available materials.