公开(公告)号：US20230261009A1

公开(公告)日：2023-08-17

申请号：US18304483

申请日：2023-04-21

Applicant: InnoLux Corporation

Inventor： Ti-Chung CHANG ,  Chih-Chieh WANG ,  Chien-Chih CHEN

IPC: H01L27/12 ,  H01L23/498 ,  H10K77/10

CPC classification number: H01L27/1244 ,  H01L27/1262 ,  H01L23/4985 ,  H01L27/1218 ,  H10K77/111 ,  H10K2102/311

Abstract: An electronic device having a peripheral area and a non-peripheral area adjacent to the peripheral area is provided. The electronic device includes a flexible substrate, a first conductive layer disposed on the flexible substrate and disposed in the peripheral area and the non-peripheral area, an organic layer disposed in the non-peripheral area and on the first conductive layer, a second conductive layer disposed on the first conductive layer, and an organic structure disposed between the first conductive layer and the second conductive layer in the peripheral area. The organic layer and the organic structure are the same material layer.

公开(公告)号：US20190355761A1

公开(公告)日：2019-11-21

申请号：US16390402

申请日：2019-04-22

Applicant: InnoLux Corporation

Inventor： Ti-Chung CHANG ,  Chih-Chieh WANG ,  Chien-Chih CHEN

IPC: H01L27/12 ,  H01L23/498

Abstract: The present disclosure is related to an electronic device that includes a display area and a non-display area. The electronic device includes a supporting substrate, a flexible substrate, a first organic insulating layer, a first conductive layer, a second conductive layer, a second organic insulating layer, and a resilient structure. The flexible substrate is disposed on the supporting substrate. The first organic insulating layer is disposed on the flexible substrate. The first conductive layer is disposed on the first organic insulating layer. The second conductive layer is disposed on the first conductive layer. The second organic insulating layer is disposed on the second conductive layer. The resilient structure includes resilient elements disposed between the first conductive layer and the second conductive layer. The first conductive layer alternatively contacts the second conductive layer and the resilient elements.

公开(公告)号：US20240363649A1

公开(公告)日：2024-10-31

申请号：US18769713

申请日：2024-07-11

Applicant: InnoLux Corporation

Inventor： Ti-Chung CHANG ,  Chih-Chieh WANG ,  Chien-Chih CHEN

IPC: H01L27/12 ,  H01L23/498 ,  H10K77/10 ,  H10K102/00

CPC classification number: H01L27/1244 ,  H01L23/4985 ,  H01L27/1218 ,  H01L27/1262 ,  H10K77/111 ,  H10K2102/311

Abstract: An electronic device having a first area and a second area adjacent to the first area is provided, which includes a flexible substrate, a first conductive layer disposed on the flexible substrate and in the first area and the second area, a semiconductor disposed on the flexible substrate and electrically connected to the first conductive layer, a second conductive layer disposed on the first conductive layer, and an organic layer disposed on the first conductive layer and in the first area and the second area. The second conductive layer has a first portion and a second portion are respectively contacted the first conductive layer in the first area. In a cross-sectional view, a first portion of the organic layer is directly contacted the first conductive layer and the second conductive layer and disposed between the first portion and the second portion of the second conductive layer.

公开(公告)号：US20210082970A1

公开(公告)日：2021-03-18

申请号：US17109263

申请日：2020-12-02

Applicant: InnoLux Corporation

Inventor： Ti-Chung CHANG ,  Chih-Chieh WANG ,  Chien-Chih CHEN

IPC: H01L27/12 ,  H01L23/498 ,  H01L51/00

Abstract: An electronic device is provided. The electronic device includes a supporting substrate, a flexible substrate disposed on the supporting substrate, a first conductive layer disposed on the flexible substrate, a second conductive layer disposed on the first conductive layer, a plurality of organic elements disposed between the first conductive layer and the second conductive layer, and an opening passing through the supporting substrate and exposing a portion of the flexible substrate. The first conductive layer alternately contacts the second conductive layer and the plurality of organic elements.