公开(公告)号：US20240241455A1

公开(公告)日：2024-07-18

申请号：US18540809

申请日：2023-12-14

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ju-Li WANG ,  Chun-Hung CHEN

IPC: G03F9/00 ,  G03F1/44 ,  G03F1/48 ,  G03F7/00

CPC classification number: G03F9/7076 ,  G03F1/44 ,  G03F1/48 ,  G03F7/70683 ,  G03F7/7085

Abstract: The electronic device of the present disclosure includes a redistribution structure, chip units, and a protective layer. The redistribution structure includes alignment marks. The chip units are electrically connected to the redistribution structure, and include a first chip unit and a second chip unit. The protective layer surrounds the first chip unit and the second chip unit. The chip units and the alignment marks are arranged along a direction. The first chip unit is disposed between the first alignment mark and the third alignment mark, and the second chip unit is disposed between the second alignment mark and the fourth alignment mark. The second alignment mark and the third alignment mark are disposed between the first chip unit and the second chip unit. The number of the alignment marks is greater than the number of the chip units.