公开(公告)号：US20250087547A1

公开(公告)日：2025-03-13

申请号：US18810891

申请日：2024-08-21

Applicant: InnoLux Corporation

Inventor： Chung-Jyh LIN ,  Yen-Fu LIU ,  Ju-Li WANG

IPC: H01L23/367 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic device is provided, including a chip unit, a heat dissipation film, an encapsulation layer, a through hole, and a circuit structure. The chip unit has a first side and a second side opposite to the first side. The heat dissipation film is disposed on the first side. The encapsulation layer surrounds the chip unit and the heat dissipation film. The through hole penetrates the encapsulation layer, and has a first position and a second position. The circuit structure is disposed on the second side. The through hole is electrically connected to the chip unit through the circuit structure. The first position is connected to the circuit structure, and the second position is farther away from the circuit structure than the first position. The first position has a first width, the second position has a second width, and the first width is greater than the second width.

公开(公告)号：US20240404904A1

公开(公告)日：2024-12-05

申请号：US18655448

申请日：2024-05-06

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Wei-Yuan CHENG ,  Ju-Li WANG

IPC: H01L23/31 ,  H01L23/00

Abstract: An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically connecting the electronic component. The protective layer has a second surface away from the active surface, and a first step difference between the first surface and the second surface is between 1 and 10 μm.

公开(公告)号：US20240377338A1

公开(公告)日：2024-11-14

申请号：US18630370

申请日：2024-04-09

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ju-Li WANG

IPC: G01N21/956 ,  G01N21/88

Abstract: An inspection method for electronic devices includes the steps of: providing an object under test; inspecting the object under test through an inspection system having an optical apparatus, including the steps of: using the optical apparatus to provide a first inspection light to inspect a first position of the object under test, and then receiving a first reflection light for being recorded in a controller; moving the optical apparatus; and using the optical apparatus to provide a second inspection light to inspect the first position of the object under test, and then receiving a second reflection light for being recorded in the controller; and determining whether there is an abnormality through the first reflection light and the second reflection light.

公开(公告)号：US20240332158A1

公开(公告)日：2024-10-03

申请号：US18598066

申请日：2024-03-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Yen-Fu LIU ,  Wen-Hsiang LIAO ,  Te-Hsun LIN ,  Ju-Li WANG ,  Dong-Yan YANG ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2224/13105 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.

公开(公告)号：US20250014956A1

公开(公告)日：2025-01-09

申请号：US18741160

申请日：2024-06-12

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Ju-Li WANG ,  Zi-Zhong WANG ,  Yen-Fu LIU

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/367 ,  H01L23/58

Abstract: An electronic device includes an electronic unit having a first side and a second side; an encapsulation layer surrounding the electronic unit and having a plurality of openings exposing the second side of the electronic unit; a first circuit structure disposed on the first side of the electronic unit and electrically connected to the electronic unit; a second circuit structure disposed on the second side of the electronic unit; a via penetrating the encapsulation layer and electrically connecting the first circuit structure to the second circuit structure; and a heat dissipation layer disposed on the second side of the electronic unit, wherein the heat dissipation layer contacts the electronic unit through the plurality of openings.

公开(公告)号：US20240404831A1

公开(公告)日：2024-12-05

申请号：US18655360

申请日：2024-05-06

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Zheng-Wei WU ,  Ju-Li WANG

IPC: H01L21/304 ,  H01L21/56 ,  H01L23/31

Abstract: An electronic device includes a chip, a protection, a molding layer and a redistribution structure layer. The chip has an active surface and a first side surface connected to the active surface. The protection layer is disposed on the active surface of the chip and has a second side surface. The molding layer surrounds the chip and the protection layer. The redistribution structure layer is disposed on the molding layer, on the protection layer and electrically connected to the chip. The roughness of the first side surface is different from the roughness of the second side surface.

公开(公告)号：US20240038550A1

公开(公告)日：2024-02-01

申请号：US17969703

申请日：2022-10-20

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Cheng-Chi WANG ,  Yu-Jen CHANG ,  Ju-Li WANG

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  C23C14/34 ,  C23C14/58 ,  C23C28/02 ,  C23C28/00 ,  C25D7/12

CPC classification number: H01L21/486 ,  H01L24/13 ,  H01L24/11 ,  H01L23/49838 ,  H01L23/49827 ,  C23C14/34 ,  C23C14/5873 ,  C23C28/023 ,  C23C28/322 ,  C25D7/123 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/11462 ,  H01L2224/13005 ,  H01L2224/13021 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L24/32 ,  H01L2224/32225 ,  H01L24/73 ,  H01L2224/73203 ,  H01L21/6835

Abstract: The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.

公开(公告)号：US20240361353A1

公开(公告)日：2024-10-31

申请号：US18613424

申请日：2024-03-22

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ju-Li WANG

IPC: G01R1/073 ,  G01R3/00

CPC classification number: G01R1/07328 ,  G01R3/00

Abstract: A circuit structure, an electronic device, and a manufacturing method of the electronic device are provided. The circuit structure includes a support layer, a base layer, and a circuit layer. The base layer is disposed on the support layer. The circuit layer is disposed on the base layer and includes a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the base layer. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer. The elongation of the support layer is smaller than the elongation of the base layer.

公开(公告)号：US20240241455A1

公开(公告)日：2024-07-18

申请号：US18540809

申请日：2023-12-14

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ju-Li WANG ,  Chun-Hung CHEN

IPC: G03F9/00 ,  G03F1/44 ,  G03F1/48 ,  G03F7/00

CPC classification number: G03F9/7076 ,  G03F1/44 ,  G03F1/48 ,  G03F7/70683 ,  G03F7/7085

Abstract: The electronic device of the present disclosure includes a redistribution structure, chip units, and a protective layer. The redistribution structure includes alignment marks. The chip units are electrically connected to the redistribution structure, and include a first chip unit and a second chip unit. The protective layer surrounds the first chip unit and the second chip unit. The chip units and the alignment marks are arranged along a direction. The first chip unit is disposed between the first alignment mark and the third alignment mark, and the second chip unit is disposed between the second alignment mark and the fourth alignment mark. The second alignment mark and the third alignment mark are disposed between the first chip unit and the second chip unit. The number of the alignment marks is greater than the number of the chip units.

公开(公告)号：US20240102853A1

公开(公告)日：2024-03-28

申请号：US17980562

申请日：2022-11-04

Applicant: InnoLux Corporation

Inventor： Yu-Chia HUANG ,  Ju-Li WANG ,  Nai-Fang HSU ,  Cheng-Chi WANG ,  Jui-Jen YUEH

IPC: G01J1/04

CPC classification number: G01J1/0437 ,  G01J1/0411

Abstract: An electronic device and a related tiled electronic device are disclosed. The electronic device includes a protective layer, a circuit structure, a sensing element and a control unit. The circuit structure is disposed on the protective layer and surrounds the sensing element. The control unit is disposed between the circuit structure and the protective layer and electrically connected to the sensing element. The protective layer surrounds the control unit and contacts a surface of the circuit structure.