公开(公告)号：US20250072190A1

公开(公告)日：2025-02-27

申请号：US18783925

申请日：2024-07-25

Applicant: InnoLux Corporation

Inventor： Chia-Chun LIU ,  Hao-Jung HUANG ,  Kuo-Feng HSU

IPC: H01L33/62 ,  H01L25/075

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes at least two sub-parts, and the at least two sub-parts respectively include a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially disposed in the through hole and in contact with at least one first upper surface and the second upper surface.

公开(公告)号：US20250048817A1

公开(公告)日：2025-02-06

申请号：US18764800

申请日：2024-07-05

Applicant: InnoLux Corporation

Inventor： Chia-Chun LIU ,  Hao-Jung HUANG ,  Kuo-Feng HSU

IPC: H01L33/62 ,  H01L25/16

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface and a first side surface. The second substrate is disposed opposite to the first substrate. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates through the first substrate. In addition, in a top-view diagram, the through hole includes an extension area. The conductive material is partially disposed in the extension area and in contact with the first upper surface and the second upper surface.