公开(公告)号：US20240072459A1

公开(公告)日：2024-02-29

申请号：US18227285

申请日：2023-07-27

Applicant: InnoLux Corporation

Inventor： Chia-Chun LIU ,  Hao-Jung HUANG

IPC: H01R4/58 ,  H01R12/52 ,  H01R12/61 ,  H01R12/62

CPC classification number: H01R4/58 ,  H01R12/52 ,  H01R12/61 ,  H01R12/62

Abstract: An electrical connection structure including a first substrate, a first conductive pad, a second substrate, a second conductive pad, at least two through holes and a conductive material. The first conductive pad is disposed on the first substrate and includes a first top surface. The second conductive pad is disposed on the second substrate and includes a second top surface. The at least two through holes pass through the first substrate and expose portions of the second top surface. A portion of the conductive material is disposed within the at least two through holes, and the conductive material electrically connects the first conductive pad and the second conductive pad.

公开(公告)号：US20250070035A1

公开(公告)日：2025-02-27

申请号：US18780899

申请日：2024-07-23

Applicant: InnoLux Corporation

Inventor： Chia-Chun LIU ,  Hao-Jung HUANG

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L25/075 ,  H01L25/16

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates through the first substrate. In addition, in a top-view diagram, an area of the through hole is larger than an area of the first conductive pad. The conductive material is partially disposed in the through hole and in contact with the first upper surface and the second upper surface.

公开(公告)号：US20170084865A1

公开(公告)日：2017-03-23

申请号：US15200056

申请日：2016-07-01

Applicant: InnoLux Corporation

Inventor： Kuang-Pin CHAO ,  Chia-Chun LIU ,  Chao-Hsiang WANG ,  Yi- Ching CHEN

IPC: H01L51/52

CPC classification number: H01L51/5246 ,  H01L51/5237

Abstract: An organic light-emitting diode display is provided. The organic light-emitting diode display includes a first substrate, a second substrate, a frit, a metal layer, and an insulating layer. The second substrate is arranged to be separated from the first substrate. The frit is located between the first and second substrates. The metal layer is disposed on the first substrate, and the frit is located on the metal layer. The metal layer includes at least one opening. The frit is located in the opening. The frit has a number of voids arranged to correspond to the opening.

公开(公告)号：US20250072190A1

公开(公告)日：2025-02-27

申请号：US18783925

申请日：2024-07-25

Applicant: InnoLux Corporation

Inventor： Chia-Chun LIU ,  Hao-Jung HUANG ,  Kuo-Feng HSU

IPC: H01L33/62 ,  H01L25/075

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes at least two sub-parts, and the at least two sub-parts respectively include a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially disposed in the through hole and in contact with at least one first upper surface and the second upper surface.

公开(公告)号：US20250048817A1

公开(公告)日：2025-02-06

申请号：US18764800

申请日：2024-07-05

Applicant: InnoLux Corporation

Inventor： Chia-Chun LIU ,  Hao-Jung HUANG ,  Kuo-Feng HSU

IPC: H01L33/62 ,  H01L25/16

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface and a first side surface. The second substrate is disposed opposite to the first substrate. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates through the first substrate. In addition, in a top-view diagram, the through hole includes an extension area. The conductive material is partially disposed in the extension area and in contact with the first upper surface and the second upper surface.