公开(公告)号：US20240411189A1

公开(公告)日：2024-12-12

申请号：US18653109

申请日：2024-05-02

Applicant: InnoLux Corporation

Inventor： Mei-Hsiu PAN ,  Chung-Wen YEN ,  Shing-Fei CHEN

IPC: G02F1/1362

Abstract: A circuit substrate with multiple voltage input ports. A substrate has an active area and a peripheral area surrounding the active area. A signal transmitting structure is disposed on the active area and the peripheral area. A conductive structure is disposed on the peripheral area, and is electrically connected to the signal transmitting structure. The conductive structure includes first conductive wiring, second conductive wiring, and converging wiring. At the first end of the converging wiring, the converging wiring receives a first signal from the first conductive wiring, and receives a second signal from the second conductive wiring. The converging wiring outputs a third signal to the signal transmitting structure through its second end. The third signal is a common voltage.

公开(公告)号：US20230387141A1

公开(公告)日：2023-11-30

申请号：US18301362

申请日：2023-04-17

Applicant: InnoLux Corporation

Inventor： Hsi-Chia WU ,  Mei-Hsiu PAN ,  Tzu-Yi LIU ,  Chung-Wen YEN

IPC: H01L27/12 ,  G09G3/32

CPC classification number: H01L27/124 ,  G09G3/32 ,  G09G2300/0426 ,  G09G2300/0408 ,  G09G2300/08

Abstract: An electronic device includes a substrate, a first bus line, a second bus line, a plurality of driving units, a first signal line and a second signal line. The first bus line is disposed on the substrate and outputs a first signal. The second bus line is disposed on the substrate and outputs a second signal. The driving units are disposed between the first bus line and the second bus line, and include a first driving unit and a second driving unit which are adjacent to each other. The first signal line is electrically connected to the first bus line and transmits the first signal to the first driving unit and the second driving unit. The second signal line is electrically connected to the second bus line and transmits the second signal to at least one of the first driving unit and the second driving unit.

公开(公告)号：US20250048740A1

公开(公告)日：2025-02-06

申请号：US18919649

申请日：2024-10-18

Applicant: InnoLux Corporation

Inventor： Hsi-Chia WU ,  Mei-Hsiu PAN ,  Tzu-Yi LIU ,  Chung-Wen YEN

IPC: H01L27/12 ,  G09G3/32

Abstract: An electronic device includes a substrate, first and second driving units, a first bus line and a first signal line. The first and the second driving units are disposed on the substrate and arranged along a first direction. The first bus line is disposed on the substrate and extends along the first direction. The first signal line has a main portion, a first branch portion, and a second branch portion. The main portion is electrically connected to the first bus line and extends along a second direction different the first direction, and the first branch portion and the second branch portion extend from the main portion in opposite direction. The first driving unit has a first transistor. The second driving unit has a second transistor. The first branch portion is electrically connected to the first transistor. The second branch portion is electrically connected to the second transistor.

公开(公告)号：US20230225052A1

公开(公告)日：2023-07-13

申请号：US18063714

申请日：2022-12-09

Applicant: InnoLux Corporation

Inventor： Mei-Hsiu PAN ,  Mei-Chi HSU

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H05K1/115 ,  H05K2201/10189

Abstract: A connection structure is provided. The connection structure includes a first conductive pad, a first insulating layer, a second conductive pad, a second insulating layer, and a third conductive pad. The first insulating layer is disposed on the first conductive pad and includes a first through-hole. The second conductive pad is disposed on the first insulating layer and electrically connected to the first conductive pad through the first through-hole. The second insulating layer is disposed on the second conductive pad and includes a second through-hole and a first recessed portion. The first recessed portion overlaps the first through-hole. The third conductive pad is disposed on the second insulating layer and electrically connected to the second conductive pad through the second through-hole. The third conductive pad extends on a surface of the first recessed portion.