公开(公告)号：US20160117032A1

公开(公告)日：2016-04-28

申请号：US14886191

申请日：2015-10-19

Applicant: InnoLux Corporation

Inventor： Chen-Yu LIN ,  Yu-Heng CHEN ,  Pei-Chi HSU ,  Hsiao-Chan WANG ,  Ping-Hsu CHENG

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G06F2203/04103

Abstract: Disclosed is a touch panel including a substrate with a touch sensing region and a non-touch sensing region, wherein the non-touch sensing region surrounds the touch sensing region. A plurality of sensing electrodes are disposed on the touch sensing region. A plurality of metal traces are disposed on the non-touch sensing region and electrically connected to the sensing electrodes. A passivation layer covers the metal trace, wherein a distance between an edge of the passivation layer and the metal traces is greater than or equal to at least 140 micrometers.

Abstract translation: 公开了一种触摸面板，其包括具有触摸感测区域和非触摸感测区域的基板，其中非触摸感测区域围绕触摸感测区域。 多个感测电极设置在触摸感测区域上。 多个金属迹线设置在非触摸感测区域上并电连接到感测电极。 钝化层覆盖金属迹线，其中钝化层的边缘与金属迹线之间的距离大于或等于至少140微米。

公开(公告)号：US20250071912A1

公开(公告)日：2025-02-27

申请号：US18782870

申请日：2024-07-24

Applicant: InnoLux Corporation

Inventor： Ming-Chih TSAI ,  Yu-Heng CHEN

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/06

Abstract: A method of manufacturing an electronic device is provided. The method includes providing a substrate, disposing a composite conductive layer on the substrate, and patterning the composite conductive layer into a composite conductive pattern in two wet etching steps. Moreover, the two wet etching steps use different etching solutions.

公开(公告)号：US20230146059A1

公开(公告)日：2023-05-11

申请号：US17963204

申请日：2022-10-11

Applicant: InnoLux Corporation

Inventor： Yu-Heng CHEN

IPC: H01L31/0352 ,  H01L31/0224

CPC classification number: H01L31/03529 ,  H01L31/022408 ,  H01L31/035281

Abstract: An electronic device includes a substrate; a first electrode layer disposed on the substrate; a first insulating layer disposed on the first electrode layer, having a first opening to expose a surface of the first electrode layer; a connecting layer, wherein at least a portion of the connecting layer is disposed in the first opening, a sidewall exposure of the first opening is exposed, and the connecting layer is electrically connected to the first electrode layer; a second insulating layer disposed on the first insulating layer, having a second opening to expose a surface of the connecting layer; and a second electrode layer disposed on the second insulating layer, wherein at least a portion of the second electrode layer is disposed in the second opening, and is electrically connected to the connecting layer.