-
公开(公告)号：US20210013131A1
公开(公告)日：2021-01-14
申请号：US16899780
申请日：2020-06-12
Applicant: InnoLux Corporation
Inventor： Wei-Cheng CHU , Chih-Yuan LEE , Yun-Chih TSAI
IPC: H01L23/498 , H05K1/11
Abstract: An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.
Search Results
1
records
(took 0.009 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
