DISPLAY DEVICES
    1.
    发明公开
    DISPLAY DEVICES 审中-公开

    公开(公告)号:US20230268326A1

    公开(公告)日:2023-08-24

    申请号:US18305509

    申请日:2023-04-24

    Abstract: A display device is provided. The display device includes a substrate having a surface including a display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes an electrode; and a plurality of bonding pads disposed on the substrate; a conductive element disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; and a first matrix element disposed on the substrate, wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve.

    ELECTRONIC DEVICE
    5.
    发明申请

    公开(公告)号:US20210013131A1

    公开(公告)日:2021-01-14

    申请号:US16899780

    申请日:2020-06-12

    Abstract: An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.

    DISPLAY DEVICE
    6.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190088196A1

    公开(公告)日:2019-03-21

    申请号:US16114633

    申请日:2018-08-28

    Abstract: A display device is provided. The display device includes a first light-emitting diode and a second light-emitting diode. The first light-emitting diode includes a first conductive pad, a second conductive pad adjacent to the first conductive pad, and a first light-emitting portion disposed on the first conductive pad. The second light-emitting diode includes a third conductive pad, a fourth conductive pad adjacent to the third conductive pad, and a second light-emitting portion disposed on the third conductive pad. A distance between the first conductive pad and the third conductive pad is less than a distance between the second conductive pad and the fourth conductive pad.

    DEVICES
    7.
    发明申请
    DEVICES 有权

    公开(公告)号:US20250046762A1

    公开(公告)日:2025-02-06

    申请号:US18919634

    申请日:2024-10-18

    Abstract: A display device is provided. The display device includes a substrate having a surface including a display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes an electrode; and a plurality of bonding pads disposed on the substrate; a conductive element disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; and a first matrix element disposed on the substrate, wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve.

    ELECTRONIC DEVICE
    8.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240055419A1

    公开(公告)日:2024-02-15

    申请号:US18493941

    申请日:2023-10-25

    CPC classification number: H01L25/167 H01L33/58 H01L25/0753 H01L33/62

    Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of diodes, at least one transistor, a chip, a conductive layer and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The plurality of diodes are disposed on the first surface of the substrate. The at least one transistor is disposed on the first surface of the substrate and electrically connected to at least one of the plurality of diodes. The chip is disposed on the second surface of the substrate and electrically connected to the at least one transistor. The conductive layer is disposed between the substrate and the chip. The protection layer is disposed between the conductive layer and the chip. Moreover, the protection layer has an opening and through which the chip is electrically connected to the conductive layer.

    ELECTRONIC DEVICE
    9.
    发明申请

    公开(公告)号:US20230037560A1

    公开(公告)日:2023-02-09

    申请号:US17968537

    申请日:2022-10-18

    Abstract: A flexible circuit structure includes: a flexible substrate having a surface; a plurality of first pads disposed on the surface; and an insulating layer disposed on the surface and between two adjacent first pads of the plurality of first pads, wherein the insulating layer has a first maximum height in a normal direction of the surface, one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height.

    DISPLAY DEVICE
    10.
    发明申请

    公开(公告)号:US20220293578A1

    公开(公告)日:2022-09-15

    申请号:US17827944

    申请日:2022-05-30

    Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.

Patent Agency Ranking