公开(公告)号：US20230083007A1

公开(公告)日：2023-03-16

申请号：US17988775

申请日：2022-11-17

Applicant: Innolux Corporation

Inventor： Jia Sin Li ,  Tong-Jung Wang ,  Chia-Chieh Fan ,  Shan Shan Hsu ,  Chih Han Ma

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.

公开(公告)号：US20210259103A1

公开(公告)日：2021-08-19

申请号：US17155097

申请日：2021-01-22

Applicant: Innolux Corporation

Inventor： Jia Sin Li ,  Tong-Jung Wang ,  Chia-Chieh Fan ,  Shan Shan Hsu ,  Chih Han Ma

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.