公开(公告)号：US09330874B2

公开(公告)日：2016-05-03

申请号：US14456972

申请日：2014-08-11

Applicant: Innovative Micro Technology

Inventor： Benedikt Zeyen ,  Vikram Patil

IPC: H01H59/00 ,  H01H49/00

CPC classification number: H01H59/0009 ,  B81C1/00333 ,  H01H49/00 ,  H03H9/1057

Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.

Abstract translation: 用于在微细结构中形成空腔的方法包括用低温焊料密封该空腔。 该方法可以包括在衬底上形成牺牲层，在牺牲层上形成柔性膜，形成通过柔性膜到牺牲层的释放孔，通过释放孔引入蚀刻剂以去除牺牲层，然后密封 该释放孔与低温焊料。