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公开(公告)号：US12081192B2
公开(公告)日：2024-09-03
申请号：US18324902
申请日：2023-05-26
CPC分类号： H03H9/1057 , B81B7/007 , B81C1/00182 , B81C1/00269 , B81C1/00301 , G01L9/0042 , G01L9/0073 , G01L9/12 , H03H3/0072 , H03H3/0073 , H03H9/0561 , H03H9/2405 , H03H9/2426 , H03H9/2431 , H03H9/2436 , B81B2203/0307 , H03H2009/2442 , H03H9/2452 , H03H9/2463 , H03H9/2473 , H03H9/2478
摘要： A MEMS device may include: (i) a lower cavity, including a first island, formed within a first layer of the MEMS device; (ii) an upper cavity, including a second island, formed within a second layer of the MEMS device; (iii) a MEMS resonating element arranged in a device layer of the MEMS device and anchored via the first and second islands; (iv) a first set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an in-plane mode that is arranged in the device layer of the MEMS device; and (v) a second set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an out-of-plane mode that is electrically isolated from the first set of electrodes and located in the first or second layer of the MEMS device, and wherein the out-of-plane mode is a torsional mode or a saddle mode.
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公开(公告)号：US20240125599A1
公开(公告)日：2024-04-18
申请号：US18347875
申请日：2023-07-06
IPC分类号： G01C19/5719 , B81C1/00 , H03H3/007 , H03H9/10
CPC分类号： G01C19/5719 , B81C1/00182 , H03H3/0072 , H03H9/1057 , B81B3/0051 , B81B2203/0172
摘要： A dual-shell architecture and methods of fabrication of fused quartz resonators is disclosed. The architecture may include two encapsulated and concentric cavities using plasma-activated wafer bonding followed by the high-temperature glassblowing. The dual-shell architecture can provide a protective shield as well as a “fixed-fixed” anchor for the sensing element of the resonators. Structures can be instrumented to operate as a resonator, a gyroscope, or other vibratory sensor and for precision operation in a harsh environment. Methods for fabricating a dual-shell resonator structure can include pre-etching cavities on a cap wafer, pre-etching cavities on a device wafer, bonding the device wafer to a substrate wafer to form a substrate pair and aligning and bonding the cap wafer to the substrate pair to form a wafer stack with aligned cavities including a cap cavity and a device cavity. The wafer stack may be glassblown to form a dual-shell structure.
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公开(公告)号：US20230396230A1
公开(公告)日：2023-12-07
申请号：US18454034
申请日：2023-08-22
发明人： Anindya PODDAR , Hau NGUYEN , Masamitsu MATSUURA
CPC分类号： H03H9/02133 , H03H9/02102 , H03H9/02448 , H03H9/0523 , H03H9/0533 , H03H9/0547 , H03H9/1057 , H03H9/17 , H03H9/2426 , H03H9/2457 , H03H3/0073 , H03H3/04 , H03H9/1021 , H03H2003/0407
摘要： In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.
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公开(公告)号：US11824517B2
公开(公告)日：2023-11-21
申请号：US17954892
申请日：2022-09-28
发明人： Ville Kaajakari , Ryota Kawai , Yoshiyuki Higuchi
CPC分类号： H03H9/1057 , H03H9/0595 , H03H9/2489
摘要： A resonator may include a vibrating portion that includes a plurality of vibrating arms to numbering in three or more, each having a fixed end, and including at least two vibrating arms to bend out of plane with different phases and a base portion having a fore end portion to which the fixed end of each of the plurality of vibrating arms to is connected and a rear end portion opposed to the fore end portion; a holding portion configured to hold the vibrating portion; and a support arm having one end connected to the holding portion and the other end connected to the rear end portion of the base portion. The support arm is asymmetric with respect to a center line of the vibrating portion with respect to a longitudinal direction in plan view.
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公开(公告)号：US11757425B2
公开(公告)日：2023-09-12
申请号：US16884401
申请日：2020-05-27
CPC分类号： H03H9/1057 , B81B7/0038 , B81C1/00285 , H03H3/0072 , H03H9/2457 , B81B2201/0271 , B81C2203/0118
摘要： A resonance device that includes a MEMS substrate including a resonator, an upper cover, and a bonding portion that bonds the MEMS substrate to the upper cover to seal a vibration space of the resonator. The bonding portion includes a eutectic layer composed of a eutectic alloy of germanium and a metal mainly containing aluminum, a first titanium (Ti) layer, a first aluminum oxide film, and a first conductive layer consecutively arranged from the MEMS substrate to the upper cover.
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公开(公告)号：US11677379B2
公开(公告)日：2023-06-13
申请号：US17544120
申请日：2021-12-07
申请人： SiTime Coporation
CPC分类号： H03H9/125 , H03H3/0077 , H03H9/02259 , H03H9/02401 , H03H9/02448 , H03H9/1057 , H03H9/17 , H03H9/2463 , H03H2003/027 , H03H2009/02181 , H03H2009/02307 , H03H2009/155
摘要： A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.
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公开(公告)号：US20180226937A1
公开(公告)日：2018-08-09
申请号：US15941095
申请日：2018-03-30
CPC分类号： H03H3/0072 , H03H3/0077 , H03H3/04 , H03H9/0561 , H03H9/0595 , H03H9/1057 , H03H9/2489 , H03H2003/0435
摘要： A resonance device that includes a lower cover formed from non-degenerate silicon; a resonator having a degenerate silicon substrate with a lower surface facing the lower cover, and including first and second electrode layers laminated on the substrate with a piezoelectric film formed therebetween and having a surface opposing an upper surface of the substrate. Moreover, the lower surface of the substrate has an adjustment region where a depth or height of projections and recesses formed on the surface is larger than that in another region of the lower surface of the substrate or is a region where an area of the projections and recesses is larger than that in the other region of the lower surface of the substrate.
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公开(公告)号：US20180191330A1
公开(公告)日：2018-07-05
申请号：US15904975
申请日：2018-02-26
发明人： Toshio Nishimura , Ville Kaajakari
CPC分类号： H03H9/2405 , H03H9/02433 , H03H9/0595 , H03H9/1057 , H03H2009/0244
摘要： A resonator that includes a piezoelectric vibrator, a frame, and a first node generator between the piezoelectric vibrator and the frame. Moreover, a first connecting arm connects the first node generator to the piezoelectric vibrator that opposes the first, and a first holding arm connects the first node generator to a part of the frame that opposes the first node generator. The first node generator includes a width extending in a second direction, which is orthogonal to a first direction of the first connecting arm, that is a maximum width where the first node generator is closer to the first connecting arm than a center of the first node generator relative to the first direction. Moreover, the width of the first node generator gradually decreases from the maximum width as the first node generator extends towards the first holding arm.
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公开(公告)号：US20180175824A1
公开(公告)日：2018-06-21
申请号：US15898300
申请日：2018-02-16
发明人： WAKANA HIROTA
CPC分类号： H03H9/0595 , H03H9/10 , H03H9/1057 , H03H9/215 , H03H9/2489 , H03H2009/155
摘要： A resonator includes a vibration portion with a base and a plurality of vibration arms each having a fixed end and a free end with the fixed end being connected to the base. Each of the plurality of vibration arms includes a piezoelectric thin film and an electrode stacked on the piezoelectric thin film. Moreover, a width of each of the plurality of vibration arms increases from the fixed end toward the free end. In addition, a width of the electrode of each of the plurality of vibration arms increases from the fixed end towards the free end of the vibration arm.
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公开(公告)号：US20180048288A1
公开(公告)日：2018-02-15
申请号：US15725436
申请日：2017-10-05
发明人： WAKANA HIROTA , Ville Kaajakari
CPC分类号： H03H9/24 , B06B1/0603 , B06B1/0607 , H03H3/0072 , H03H3/0078 , H03H9/0595 , H03H9/1057 , H03H9/205 , H03H9/2489 , H03H2003/0435 , H03H2009/02511
摘要： In a resonator is provided that suppresses a shift of a resonant frequency. The resonator includes a vibration portion that has a base with front and rear ends and multiple vibration arms with fixed ends connected to the front end of the base and that extend away from the front end. Moreover, the resonator includes a frame that at least partially surrounds the vibration portion and one or more holding arms provided between the vibration portion and the frame with first ends connected to the base and the second ends connected to a region of the frame at the front end side relative to the rear end of the base portion.
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