公开(公告)号：US20230245944A1

公开(公告)日：2023-08-03

申请号：US17635437

申请日：2021-07-28

Applicant: Institute of Semiconductors, Guangdong Academy of Sciences

Inventor： Yingqiang Yan ,  Chuan Hu ,  Zhikuan Chen ,  Zhitao Chen

IPC: H01L23/367 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L23/3675 ,  H01L23/29 ,  H01L21/56

Abstract: A fan-out type package and a preparation method of the fan-out type package are provided. The fan-out type package has one or more chips having same or different functions and each having a back surface mounted in a chip mounting region of the heat dissipation sheet via the adhesive material layer, and a front surface covered by a temporary protection material; an adhesive material layer; a heat dissipation sheet; an encapsulation material layer formed by making an encapsulation material flow into and fill a gap between the temporary protection material and the heat dissipation sheet and/or cover a side of the heat dissipation sheet opposite to a side thereof mounted with the chip, and then removing the temporary protection material; a packaging circuit grown on the front surface of the chip, the encapsulation material, and the heat dissipation sheet; and a packaging circuit protection layer protecting the packaging circuit.

公开(公告)号：US12184253B2

公开(公告)日：2024-12-31

申请号：US18038371

申请日：2021-07-27

Applicant: INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES

Inventor： Yingqiang Yan ,  Chuan Hu ,  Xun Xiang ,  Wei Zheng ,  Zhitao Chen ,  Zhikuan Chen

IPC: H03H1/00

Abstract: A filter radio frequency module packaging structure and a method for manufacturing same is disclosed. A first filter chip of the filter radio frequency module packaging structure comprises a chip main body and a wall structure. The wall structure, the functional surface, and a substrate together define a closed cavity, or the wall structure and the functional surface together define a closed cavity. An encapsulation material wraps the first filter chip.