公开(公告)号：US20230084375A1

公开(公告)日：2023-03-16

申请号：US17475123

申请日：2021-09-14

申请人： Intel Corporation

发明人： Priyanka Dobriyal ,  Ankur Agrawal ,  Anna M. Prakash ,  Ann J. Xu ,  Jimin Yao ,  Raiyomand F. Aspandiar ,  Lesley A. Polka Wood ,  Abigail G. Agwai ,  Kayleen L. E. Helms

IPC分类号： H01S5/0237 ,  H01S5/0234

摘要： An apparatus comprising an integrated circuit chip comprising a first surface region and a second surface region adjacent to the first surface region; a substrate coupled to the integrated circuit chip through a plurality of connections comprising solder; and underfill between the substrate and the integrated circuit chip, wherein the underfill contacts the second surface region, but does not contact the first surface region.