公开(公告)号：US10282341B2

公开(公告)日：2019-05-07

申请号：US15671900

申请日：2017-08-08

Applicant: Intel Corporation

Inventor： Bryan L. Spry ,  Marcus W. Song ,  Deepak M. Rangaraj ,  Avinash N. Ananthakrishnan ,  Robert J. Hayes ,  Aimee D. Wood ,  Adam E. Letendre ,  Brent R. Boswell

IPC: G06F13/20 ,  G06F13/42 ,  G06F13/12

Abstract: Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.