公开(公告)号：US20250062168A1

公开(公告)日：2025-02-20

申请号：US18451852

申请日：2023-08-18

Applicant: Intel Corporation

Inventor： Justin WHETTEN ,  Zhou YANG ,  Zheng KANG ,  Haowen LIU ,  Bassam ZIADEH ,  Vijay Krishnan SUBRAMANIAN ,  John HARPER ,  Pramod MALATKAR ,  Patrick NARDI ,  Anthony MONTERROSA ,  Michael TAN ,  Sean BUSHELL

IPC: H01L23/24 ,  B23K26/362 ,  H01L21/268 ,  H01L21/67

Abstract: The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.