公开(公告)号：US20250110285A1

公开(公告)日：2025-04-03

申请号：US18478607

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Sufi R. Ahmed ,  Darren Vance ,  Sang Yup Kim ,  Anthony Traynor ,  Eric J. M. Moret

IPC: G02B6/36

Abstract: Architectures and methods for attaching photonic integrated circuits (PICs) to optical connectors. The architectures are characterized by (1) a cavity at a specific location with respect to a trench alongside an optical facet of the PIC die, (2) index matching epoxy (IME) in the trench and in the cavity, and (3) the use of a snap cure adhesive between the PIC and the optical connector.

公开(公告)号：US11841540B2

公开(公告)日：2023-12-12

申请号：US16955963

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Nicholas D. Psaila ,  Graeme Brown ,  John Macdonald ,  Paul Mitchell ,  Mark Hesketh ,  Anthony Traynor ,  Richard Laming

IPC: G02B6/42 ,  G02B6/32

CPC classification number: G02B6/4214 ,  G02B6/32

Abstract: An optical apparatus (10) for routing an optical signal (12) comprises a body (14) comprising a material. A waveguide (16) is formed in the body (14) by laser modification of the material. The optical apparatus (10) further comprises a region (18) comprising a lower refractive index than the material of the body (14) and defines an interface (24) between the region (18) and the waveguide (16). The waveguide (16) and the interface (24) are aligned relative to each other for routing the optical signal (12) therebetween and reflecting the optical signal (12) at the interface (24).