公开(公告)号：US10401286B1

公开(公告)日：2019-09-03

申请号：US15934722

申请日：2018-03-23

Applicant: Intel Corporation

Inventor： Jianyong Mo ,  Darren Vance ,  Di Xu ,  Liang Zhang

IPC: G01N21/55 ,  G06T7/00 ,  G06T1/00 ,  G01N21/17

Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.

公开(公告)号：US20250110285A1

公开(公告)日：2025-04-03

申请号：US18478607

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Sufi R. Ahmed ,  Darren Vance ,  Sang Yup Kim ,  Anthony Traynor ,  Eric J. M. Moret

IPC: G02B6/36

Abstract: Architectures and methods for attaching photonic integrated circuits (PICs) to optical connectors. The architectures are characterized by (1) a cavity at a specific location with respect to a trench alongside an optical facet of the PIC die, (2) index matching epoxy (IME) in the trench and in the cavity, and (3) the use of a snap cure adhesive between the PIC and the optical connector.

公开(公告)号：US20250102744A1

公开(公告)日：2025-03-27

申请号：US18476089

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kumar Abhishek Singh ,  Peter A. Williams ,  Ziyin Lin ,  Fan Fan ,  Yang Wu ,  Saikumar Jayaraman ,  Baris Bicen ,  Darren Vance ,  Anurag Tripathi ,  Divya Pratap ,  Stephanie J. Arouh

IPC: G02B6/42

Abstract: Technologies for fiber array unit (FAU) lid designs are disclosed. In one embodiment, channels in the lid allow for suction to be applied to fibers that the lid covers, pulling the fibers into place in a V-groove. The suction can hold the fibers in place as the fiber array unit is mated with a photonic integrated circuit (PIC) die. Additionally or alternatively, channels can be on pitch, allowing for pulling the FAU towards a PIC die as well as sensing the position and alignment of the FAU to the PIC die. In another embodiment, a warpage amount of a PIC die is characterized, and a FAU lid with a similar warpage is fabricated, allowing for the FAU to position fibers correctly relative to waveguides in the PIC die. In another embodiment, a FAU has an extended lid, which can provide fiber protection as well as position and parallelism tolerance control.