公开(公告)号：US20250087542A1

公开(公告)日：2025-03-13

申请号：US18466019

申请日：2023-09-13

Applicant: Intel Corporation

Inventor： Man Chun OOH ,  Wei Chung LEE ,  Yean Ling SOON ,  Kor Oon LEE ,  Jackson Chung Peng KONG ,  Azniza ABD AZIZ ,  Piyush BHATT

IPC: H01L23/24 ,  H01L23/498

Abstract: The present disclosure is directed to an improved stiffener that has a body that has extension members positioned proximally to the corners of a semiconductor package substrate, and the extension members have bottom extension surfaces that extend beyond a periphery of a bottom surface of the semiconductor package substrate, and the bottom extension surfaces and the bottom surface of the semiconductor package substrate are co-planar. The present disclosure is also directed to a method for forming the improved stiffener with the extension members for a semiconductor package.