公开(公告)号：US20250087542A1

公开(公告)日：2025-03-13

申请号：US18466019

申请日：2023-09-13

Applicant: Intel Corporation

Inventor： Man Chun OOH ,  Wei Chung LEE ,  Yean Ling SOON ,  Kor Oon LEE ,  Jackson Chung Peng KONG ,  Azniza ABD AZIZ ,  Piyush BHATT

IPC: H01L23/24 ,  H01L23/498

Abstract: The present disclosure is directed to an improved stiffener that has a body that has extension members positioned proximally to the corners of a semiconductor package substrate, and the extension members have bottom extension surfaces that extend beyond a periphery of a bottom surface of the semiconductor package substrate, and the bottom extension surfaces and the bottom surface of the semiconductor package substrate are co-planar. The present disclosure is also directed to a method for forming the improved stiffener with the extension members for a semiconductor package.

公开(公告)号：US20240314923A1

公开(公告)日：2024-09-19

申请号：US18123049

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Arumanayagam RAJASEKAR ,  Hariharan KALIYAVARATHAN ,  Srinivas REDDY B.M. ,  Yagnesh Vinodrai WAGHELA ,  Piyush BHATT

IPC: H05K1/02

CPC classification number: H05K1/0224 ,  H05K2201/2081

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment, the multi-layer shield comprises a metallic layer with a first surface and a second surface opposite from the first surface, and a conductive adhesive over the first surface of the metallic layer. In an embodiment, a base layer is over the second surface of the metallic layer, where the base layer is electrically insulating.