公开(公告)号：US20200344918A1

公开(公告)日：2020-10-29

申请号：US16927701

申请日：2020-07-13

Applicant: Intel Corporation

Inventor： Berhanu WONDIMU ,  David SHIA ,  Xudong TANG

IPC: H05K7/20 ,  G05B19/042 ,  G06F1/20 ,  B23P15/26

Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.