公开(公告)号：US10468331B2

公开(公告)日：2019-11-05

申请号：US15869700

申请日：2018-01-12

Applicant: Intel Corporation

Inventor： Je-young Chang ,  Jae W. Kim ,  Ravindranath V. Mahajan ,  Blake Rogers ,  Devdatta Kulkarni

IPC: H01L23/48 ,  H01L23/473 ,  F28D9/00 ,  B23P15/26 ,  F28D21/00 ,  H01L23/28 ,  H01L23/00 ,  G06F1/20

Abstract: A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface.The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.