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公开(公告)号：US20180226711A1
公开(公告)日：2018-08-09
申请号：US15428010
申请日：2017-02-08
Applicant: Intel Corporation
Inventor： Aycan Erentok , Jose Rodrigo Camacho Perez , Brian Girvin
CPC classification number: H01Q1/243 , H01Q1/273 , H01Q1/48 , H01Q7/00 , H01Q19/22 , H04B1/3833 , H04B1/385 , H04L67/12
Abstract: An mobile device may include circuitry for transmissive communication and to operate with a ground reference. An antenna element may be in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. A housing may house the circuitry for transmissive communication and the antenna element and may include a conductive circumferential case element. A coupling device may be electrically coupled to provide the ground reference over an elongate segment of the conductive circumferential case element.
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Patent Agency Ranking
公开(公告)号：US20180262226A1
公开(公告)日：2018-09-13
申请号：US15457595
申请日：2017-03-13
Applicant: Intel Corporation
Inventor： Aycan Erentok , John Groff , Huan-Sheng Hwang , Paul Beaucourt , Thomas H. Liu , Jose R. Camacho Perez , Brian Girvin
IPC: H04B1/3888 , H04M1/04
Abstract: Example customizable example customizable wearable electronic devices, and methods of assembling the same are disclosed. An example customizable wearable electronic device includes a housing bottom member, a housing top member including a radio frequency (RF) attenuating portion that includes a material that attenuates RF energy and an RF conducting portion that includes an electrically-conductive material, the housing top member separated from the housing bottom member by an electrical isolation gap member, an electrically-conductive contact to couple the RF conducting portion of the top housing member to a communication module in the customizable wearable electronic device, and a customization part selected from a plurality of different customization parts having respective different configurations, the selected customization part electrically coupled to the RF conducting portion of the housing top member when the selected customization part is assembled to the housing top member.
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公开(公告)号：US10461402B2
公开(公告)日：2019-10-29
申请号：US15428010
申请日：2017-02-08
Applicant: Intel Corporation
Inventor： Aycan Erentok , Jose Rodrigo Camacho Perez , Brian Girvin
Abstract: An mobile device may include circuitry for transmissive communication and to operate with a ground reference. An antenna element may be in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. A housing may house the circuitry for transmissive communication and the antenna element and may include a conductive circumferential case element. A coupling device may be electrically coupled to provide the ground reference over an elongate segment of the conductive circumferential case element.
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公开(公告)号：US10075206B1
公开(公告)日：2018-09-11
申请号：US15457595
申请日：2017-03-13
Applicant: Intel Corporation
Inventor： Aycan Erentok , John Groff , Huan-Sheng Hwang , Paul Beaucourt , Thomas H. Liu , Jose R. Camacho Perez , Brian Girvin
IPC: H04B1/3888 , H04M1/04
Abstract: Example customizable example customizable wearable electronic devices, and methods of assembling the same are disclosed. An example customizable wearable electronic device includes a housing bottom member, a housing top member including a radio frequency (RF) attenuating portion that includes a material that attenuates RF energy and an RF conducting portion that includes an electrically-conductive material, the housing top member separated from the housing bottom member by an electrical isolation gap member, an electrically-conductive contact to couple the RF conducting portion of the top housing member to a communication module in the customizable wearable electronic device, and a customization part selected from a plurality of different customization parts having respective different configurations, the selected customization part electrically coupled to the RF conducting portion of the housing top member when the selected customization part is assembled to the housing top member.
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公开(公告)号：US11276915B2
公开(公告)日：2022-03-15
申请号：US16473610
申请日：2017-03-27
Applicant: Intel Corporation
Inventor： Jose Rodrigo Camacho Perez , Aycan Erentok , Huan-Sheng Hwang , Paul Beaucourt , Thomas H. Liu , Brian Girvin
Abstract: Embodiments include apparatuses, methods, and systems including an electronic apparatus having a configurable sector cavity antenna integrated into a PCB. The configurable sector cavity antenna may include a first panel embedded within a first layer of the PCB along an edge of the first layer, and a second panel embedded within a second layer of the PCB along an edge of the second layer. The configurable sector cavity antenna may further include a fixed via wall to couple the first panel and the second panel along an inner edge of the first panel and the inner edge of the second panel, and a switchable via wall to selectively couple multiple interior points of the first panel and multiple interior points of the second panel. Other embodiments may also be described and claimed
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公开(公告)号：US20180212309A1
公开(公告)日：2018-07-26
申请号：US15417108
申请日：2017-01-26
Applicant: Intel Corporation
Inventor： Jose Rodrigo Camacho Perez , Aycan Erentok , Bryce D. Horine , Brian Girvin
CPC classification number: H01Q1/2291 , H01Q1/2283 , H01Q1/273 , H01Q13/06 , H01Q13/18 , H04B1/385 , H04B2001/3866
Abstract: A wearable mobile device may include circuitry for transmissive communication, and a slotted cavity radiator in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. In embodiments, the wearable mobile device may further include a pair of conductive faces between which the circuitry for transmissive communication is positioned and that bound a cavity of the slotted cavity radiator.
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