公开(公告)号：US20230380102A1

公开(公告)日：2023-11-23

申请号：US18358329

申请日：2023-07-25

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Nishi Ahuja ,  Jun Zhang ,  Qing Qiao ,  Checa Hung ,  Yung Shun Liang ,  Min Wu ,  Ying-Shan Lo ,  Carrie Chen ,  Jia-Hong Wu

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272 ,  H05K7/20763

Abstract: Example method and apparatus, systems, and articles of manufacture for immersion cooling systems are disclosed herein. An example apparatus disclosed herein includes a tank to hold a coolant, an overflow chamber to direct the coolant toward an outlet, and a plate within the overflow chamber, the plate including a plurality of openings, the coolant to pass through at least one of the plurality of openings before reaching the outlet.