公开(公告)号：US12265830B2

公开(公告)日：2025-04-01

申请号：US17924036

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Min Wu ,  Jun Zhang ,  Yuyang Xia ,  Dan Liu ,  Chao Zhou ,  Lianchang Du ,  Carrie Chen ,  Nishi Ahuja ,  Jason Crop ,  Wenqing Lv

IPC: G06F1/26 ,  G06F1/20 ,  G06F9/44 ,  G01K7/00

Abstract: Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.

公开(公告)号：US20230380102A1

公开(公告)日：2023-11-23

申请号：US18358329

申请日：2023-07-25

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Nishi Ahuja ,  Jun Zhang ,  Qing Qiao ,  Checa Hung ,  Yung Shun Liang ,  Min Wu ,  Ying-Shan Lo ,  Carrie Chen ,  Jia-Hong Wu

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272 ,  H05K7/20763

Abstract: Example method and apparatus, systems, and articles of manufacture for immersion cooling systems are disclosed herein. An example apparatus disclosed herein includes a tank to hold a coolant, an overflow chamber to direct the coolant toward an outlet, and a plate within the overflow chamber, the plate including a plurality of openings, the coolant to pass through at least one of the plurality of openings before reaching the outlet.