公开(公告)号：US20240006786A1

公开(公告)日：2024-01-04

申请号：US17857051

申请日：2022-07-04

Applicant: Intel Corporation

Inventor： Howe Yin LOO ,  Tin Poay CHUAH ,  Jenny Shio Yin ONG ,  Chee Min LOH ,  Bok Eng CHEAH ,  Jackson Chung Peng KONG ,  Seok Ling LIM ,  Kooi Chi OOI

IPC: H01R12/57 ,  H01R12/70

CPC classification number: H01R12/57 ,  H01R12/7082 ,  H01R12/707

Abstract: The present disclosure is directed to a printed circuit board having a composite upper surface with a first section of a first-type of printed circuit board and a second section of a second-type of printed circuit board, for which the first section of the first-type of printed circuit board and the second section of the second-type of printed circuit board are coupled, respectively, to at least one device that is configured to abridge the first and second sections of the composite upper surface. In an aspect, the second-type of printed circuit board is configured to be embedded in the first-type of printed circuit board and the first-type of printed circuit board is configured to receive the second-type of printed circuit board.