公开(公告)号：US20220199486A1

公开(公告)日：2022-06-23

申请号：US17131642

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Aditi MALLIK ,  Chen ZHUANG ,  Raghuram NARAYAN

IPC: H01L23/367 ,  H01L23/373

Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.