公开(公告)号：US20250107003A1

公开(公告)日：2025-03-27

申请号：US18475920

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Chin Mian Choong ,  Jiun Hann Sir ,  Poh Boon Khoo ,  Wei Jern Tan ,  Boon Ping Koh

IPC: H05K1/18 ,  H01L23/498 ,  H01L25/18 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46 ,  H10B80/00

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed comprising: an integrated circuit package including a package substrate, the package substrate including a first contact and a second contact, the first contact to be electrically coupled to a printed circuit board (PCB); and a timing package distinct from the integrated circuit package, the timing package including a third contact, the third contact to be electrically coupled to the second contact independent of the PCB.