公开(公告)号：US10547325B2

公开(公告)日：2020-01-28

申请号：US15998803

申请日：2018-08-16

Applicant: Intel Corporation

Inventor： Smita Kumar ,  Sudhir Satpathy ,  Chris Cunningham

IPC: H03M7/34 ,  H03M7/40 ,  G06F3/06 ,  H03M7/30 ,  H03M5/02 ,  H03M13/21 ,  G06F5/00 ,  H03M7/00 ,  H03M5/14

Abstract: An embodiment of a semiconductor package apparatus may include technology to load compressed symbols in a data stream into a first content accessible memory, break a serial dependency of the compressed symbols in the compressed data stream, and decode more than one symbol per clock. Other embodiments are disclosed and claimed.

公开(公告)号：US20190044534A1

公开(公告)日：2019-02-07

申请号：US15998803

申请日：2018-08-16

Applicant: Intel Corporation

Inventor： Smita Kumar ,  Sudhir Satpathy ,  Chris Cunningham

IPC: H03M7/40 ,  G06F3/06 ,  H03M7/30

Abstract: An embodiment of a semiconductor package apparatus may include technology to load compressed symbols in a data stream into a first content accessible memory, break a serial dependency of the compressed symbols in the compressed data stream, and decode more than one symbol per clock. Other embodiments are disclosed and claimed.