公开(公告)号：US20230299516A1

公开(公告)日：2023-09-21

申请号：US18202194

申请日：2023-05-25

Applicant: Intel Corporation

Inventor： Amarjeet KUMAR ,  Navneet Kumar SINGH, I ,  Samarth ALVA ,  Richard S. PERRY ,  Christopher WEST

IPC: H01R12/52 ,  H05K7/20

CPC classification number: H01R12/52 ,  H05K7/20509

Abstract: A back-to-back ultra-slim module (USM) includes an inline USM (USMi) connector and a top mount USM (USMt) connector. The back-to-back USM assembly can be made as a double-sided module to allow a stacked module configuration to save system area. The stacked module has a USMi module inline with the system board on one side of the system board, and a USMt module vertically offset from the other side of the system board. The stacked module can have a thermal layer between the USMi module and the USMt module.