公开(公告)号：US11495514B2

公开(公告)日：2022-11-08

申请号：US17025899

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Chew Ching Lim ,  Chun Howe Sim

IPC: H01L23/367 ,  H01L23/40

Abstract: Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.

公开(公告)号：US20210183727A1

公开(公告)日：2021-06-17

申请号：US17025899

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Chew Ching Lim ,  Chun Howe Sim

IPC: H01L23/367 ,  H01L23/40

Abstract: Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.